Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management. XCede® HD结合了小巧的外形和优异的设计灵活性，实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案，从而提高耐用性。XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. XCede® HD结合了小巧的外形和优异的设计灵活性，实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案，从而提高耐用性。 XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. XCede® connectors also address. Search for: Search Home; Categories. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 5 - Effective capacity assumes average 4:1 data reduction. 0 REFERENCE 2. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Jump to a Section. 1. Pitch (mm): Circuits: Current (MAX per contact): Voltage: 1. 1. Customer Measurement Report: FCI XCede® Connector. Skip to Main Content +49 (0)89 520 462 110. Login or REGISTER Hello, {0}. Login or REGISTER Hello, {0}. DC connector configurations are determined by the customers’ system application. 1. 54mm pitch down to 0. Brand of Product：Amphenol ICC,Part#：947-4XXX-XXX,Product Category：XCede RAM SIGNAL WAFER,Data. com. Nashua, NH, February 2, 2009– Amphenol TCS, the leading provider of high performance backplane interconnect systems, today announced two additions to the XCede® connector platform – XCede 85 Ohm and XCede cables and assemblies. 4-, 5-, 6-, 8-pair configurations. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Samtec XCede High Speed / Modular Connectors are available at Mouser Electronics. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Dislaime Please note that the above information is subect to change without notice. Make your own RAM ® Mount or use RAM ® Mounts components to build a custom mount. 80mm Right-Angle Backplane Receptacle; HDTF - Samtec XCede® HD 1. XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto a printed circuit board (PCB). DDR-SDRAM stands for Double Data Rate - Synchronous Dynamic Random Access Memory and it is a common type of memory used-organized RAM in most of the processors. Available for SOLIDWORKS, Inventor, Creo, CATIA, Solid Edge, autoCAD, Revit and many more CAD software but also as STEP, STL, IGES, STL, DWG, DXF and more neutral CAD formats. 2. Features. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. XCede® connectors also address. For XCede HD RAM and XCede HD Inverted RAM refer to this documents. 4 differential signal pairs/inch. 2 The daughtercard connector building blocks include signal modules, power modules,. Revision SCR No. Description Initial Date “-“ S1188 Initial Release T. 00mm pitch (FF5026) and 050mm pitch (FF3025). 0 TOOLING 1. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingComponents. The XCede® Right-Angle Male (XCede® RAM) connector is an intelligent device that offers two options for designers. SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede High Speed / Modular Connectors are available at Mouser Electronics. 4, 6 or 8 columns. 3、4和6对设计. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 1 DOCUMENTS 2. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 11. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. For a 6-pair differential connector per column, 82. Integrated power and guidance. 1. We work with businesses, from pioneering start-ups to global brands, to find project-based or permanent talent that enables innovation in line with their vision and goals. 2 Reference Documents TB-2235 XCede HD General Product Specifications TB-2237 XCede HD Routing Guidelines TB-2252 XCede HD Backplane Connector Installation 2. In this category | In this category, (Amphenol) Memory card connector / PCI CCM01 MK5 Series. We are excited to announce the completion of a merger with TechStream and Etonwood as of Friday the 17th of January 2020. We would like to show you a description here but the site won’t allow us. Features. Buy 928-4050-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Plus Series, Receptacle, Press Fit. Accessories; Audio Products; Capacitors; Circuit Protection; Circuit Breaker Protection Devices Explained%PDF-1. Amphenol Xcede Series High Speed / Modular Connectors are available at Mouser Electronics. Login or REGISTER Hello, {0}. the use of advanced engineering polymers in a unique 3-D resonance. 3-, 4- and 6-pair designs. Scalable upgrades to 56Gb/s without costly redesigns. XCede Product Family Connector Press-fit Installation Process . RF Connectors Valcon IPEX Type RF Samtec Bulls Eye® RF Samtec Ganged RF. Once the XCede connector standoff features begin to come in contact with the PWB surface, the force vs. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. See section 4 regarding XHD2 RAM connectors. 54mm pitch down to 0. 2. . Get a Free Sample. This was soon replaced by DIMM with a 64-bit data path. 2-to-PCIE-x4 adapter cable - but it runs $150. 高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。. Available with 40, 60 and 80 signal pins. XCede® connectors also address. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. 1. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. 1. XCede® connectors also address requirements for high linear signal density at the backplane and daughter card interface. Login or REGISTER Hello, {0}. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Change LocationAmphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . See Appendix "A" for the seating press recommendations and process recommendations. 1. 99. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. XCede® connectors also address. 28G ADDITION TO THE XCEDE ® HD FAMILY XCede ® HD plus leverages the same. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 6amps per mm. XCede® connectors also address. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. Buy XCede HD Series Backplane Connectors. They are available in 1. 7mil Drill Minimum Pad Size vs. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 6 XCede RAM and Extended RAM 2 Pair Application Tools 694-4528-000 – 2-Pair RAM Loading Head 1. See Appendix “A” for the seating press recommendations and process recommendations. REPAIR PROCEDURE FOR MODULE SEE TB-2217. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management. 384 likes · 6 talking about this · 259 were here. Amphenol Communications Solutions. XCede. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCedeHD RAM and XCede HD Inverted RAMrefer to. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC. XCEDE CONNECTOR ECCN / UNSPSC / COO. Description Initial Date “A” S2401 Initial Release E. Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank. Integrated power and guidance. Dislaime Please note that the above information is subect to change without notice. Random Access Memory, or RAM (pronounced as ramm ), is the physical hardware inside a computer that temporarily stores data, serving as the computer's "working" memory. 0 REFERENCEDOCUMENTS 2. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 1. Amphenol solves system design challenges with integrated interconnect solutions for applications in the networking, communications, storage, and computer server markets. Pin header. 8 mm, Header, Press Fit. Additional RAM allows a computer to work with more information at the same time, which usually has a considerable effect on total system. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Change Location. Article: 00229048. XCede® connectors also. challenging architectures. C&K Components. Vertical or Right Angle. 2. 下载3D模块 配置并加入到购物车 配置免费样品 技术参数. 3-, 4- and 6-pair designs. 1. Founded in 2003, our vertical specialists provide global transformational talent in data, product, software, cloud and cyber. Integrated guidance, keying and polarizing side walls available. DETAILS. 特色. XCede HD, Backplane Connectors, Right Angle Header LC, 4-pair, 8-column, 85ohms. element14 Malaysia offers special pricing, same day dispatch, fast delivery, wide inventory, datasheets & technical support. XCede ® HD2 §XCede ® and AirMax are excellent and proven board-to-board connectors for backplane, mezzanine, orthogonal, or coplanar solutions up to 25Gb/s. Delete of interface FortyGigE1/0/49, and then exit the system mode and save the configuration. 5 out of 5 stars 3,424. Article: 00028492. Find Parts Learn More. For optimal connector configuration, connectors are grouped into signal modules of 4,. EspañolAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 0217" Drill XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. For XCede HD RAM. 60mm (. Description. Mouser offers inventory, pricing, & datasheets for XCede Connectors. Kuject 320 PCS Heat Shrink Wire Connectors, Multipurpose Waterproof Electrical Wire Terminals kit, Insulated Crimp Connectors Ring Fork Spade Butt Splices for Automotive Marine Boat Truck. XCede® connectors also address. DETAILS. Distance Curve of MEP-12T press for XCede and XCede Plus connectors. 1. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingThis document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). 0 specification. . (1) Notes1: XCede HD RAM and XCede HD Inverted RAM use the same tool of XCede HD Daughter. XCede® BACKPLANE CONNECTOR SYSTEM DESCRIPTION XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA. XCede® connectors also address. XCede ® HD is a small form factor system with a modular design for significant space savings and. Secured form. XCede® connectors also address. Welcome to Wille Dodge, a family-owned dealership with 44 years of. 00 mm contact wipe on signal pins. RF Connectors Valcon IPEX Type RF Samtec Bulls Eye® RF Samtec Ganged RF. use keep out zone. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. 2. XCede® connector family. 1. Pin header. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 三个等级的上电次序实现了热插拔. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card, providing up to 82. power connector (J_PWR_B) 7. XCede HD achieves the highest performance in an HM compatible form factor. DETAILS. Login or REGISTER Hello, {0}. 1 FMC VITA 57. 1. Español $ USD United States. 00 mm的触点滑动范围. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. 60mm Gen-Z connectors conform to SFF-TA-1002, OCP NIC 3. TARGET MARKETS. XCede® connectors also address. Submit a Brief. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® Connectors - Amphenol CS | DigiKeyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Skip to content. DETAILS. Lukin 10/01/13 “C” “D”. 1 XCede HD 2 Pair Backplane Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall C-923-201E-500 2 Pair, 8 Column Differential Backplane Module, Thick Wall高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。ExaMAX®可实现高达56 Gbps的性能，并使设计师能够选择优化密度或最大程度地减少电路板层数。XCede® HD是一个采用模块化设计的小型系统，可大幅节省空间并提升灵活性。The XCede ® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Advanced Search. Features. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Integrated power, guidance, keying and side walls available. Select language:Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. DC configurations may also be determined by the XHD+ RAM connector to which they will mate for co-planar applications. 2. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission and. XCede® Family Cable Assemblies MATERIAL §§Contacts: High. Login or REGISTER Hello, {0}. DETAILS. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactJ-Tech, Inc. Multiple signal/ground pin staging options. Change Location. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. Basics is present with its full range of products to meet the needs of our customers. Resource The top level of the. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 7. 4, 6 or 8 columns. Buy XCede HD Plus Series Backplane Connectors. Rugged Edge Rate® contact system. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. Two press-fit sizes, (standard and small) provide board layout options for designers. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC. PCIe Gen. 2 TB-2244 XCede HD Family Daughtercard Connector Press-Fit Installation Process 3. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Login or REGISTER Hello, {0}. 1. Login or REGISTER Hello, {0}. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 3. 7mil Drill Minimum Pad Size vs. Features & Benefits. Amphenol Xcede Series High Speed/Modular Connectors are available at Mouser Electronics. 1. xcede hd backplane assembly 4 pair connector, leadfree part no. Meets the high density needs of today's designs. 00mm: 2 - 54: 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Backwards mate compatibility. The types of memory modules available today can be broadly classified into Single In-Line Memory Module (SIMM) and Dual In-Line Memory Module (DIMM). 1. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Figure 20: Example XCede® HD Midplane Connector 20 LIST OF TABLES Table 1: XCede® HD , XCede® HD Plus and XCede® HD2 15. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. 4. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Additionally, there will be an electro-static. Get a Free Sample. Revision “F” Specification Revision Status . Brand of Product：Amphenol ICC,Part#：946-230X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho. Memory card connector / PCI. Video Library > XCede® HD - Samtec’s High-Density Backplane System XCede® HD - Samtec’s High-Density Backplane System XCede® HD features a form factor that is significantly smaller than traditional backplane solutions and has incredible design flexibility for high-density backplane applications. Get the best deals on Amphenol Backplane Connectors Connectors when you shop the largest online selection at eBay. Connectors with six differential pairs per column fit 36 mm minimum card slot pitch and provide 82. 3. Wang 2/18/16 C S7764 Updated document title, Added XCede HD2 backplane information B. Skip to Main Content (800) 346-6873. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission. Column counts of 4, 6 and 8 allow for sizing the connector to the required differential pair count. 1. 4 differential signal pairs per inch are provided corresponding to a minimum slot spacing of 36 mm. 2 617-0450-014 xcede hd 4pair stiffener 1 1 922-421f-d3h xcede hd 4pair lc mod w/ organizer, 8pos, 100ohms, bifurcated, . Type S (same-side) and Type O (opposite-side) contact layouts allow for mirrored contacts. Improves signal integrity and increases signal. They are available in 1. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. 11. The series offers mechanical longevity and ruggedness, guidance and keying options, and. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed/Modular Connectors. Four-pair connectors provide 54. A Loyalty Bonus Cash of $1,500 (applied after taxes) is offered on all new 2022 Ram 1500 Classic models and applies to current and original owners of a Chrysler, Dodge, Jeep,. - FCI. 2. 7. 00: L: Pressfit: 5: Power or coax contacts, Multi Purpose Centre, Location Peg1. Luxshare-TECH Gen-Z provides the full range of configuration: 1C，2C，4C，4C+，8C and HP (. XCedeHD RAM and XCede HD Inverted RAMrefer to. Available in industry-standard 2. We believe that unlocking the potential of our workforce through outstanding training, earnings potential and reward structures is key to Xcede’s success. 2” Long 694-4529-000 – 2-Pair RAM Loading Head 2. XCede® Stacker. 1. Find Parts Learn More. TB-2023 Amphenol TCS Commercial Connector Qualification Plan TB-2237 XCede HD Routing Guidelines 2. Vertical or Right Angle. We would like to show you a description here but the site won’t allow us. 40G QSFP+ to QSFP+ DAC Cable. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Features. BAcKpAneL connectors Fci’s Xcede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. Accessories; Audio Products; Capacitors; Circuit Protection; Circuit Breaker Protection Devices ExplainedDislaime Please note that the above information is subject to change without notice. backplane to expander board connector (BP_XCEDE_31) 4. EN. 2. Back. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane interconnect systems. XCede ® HD2 was introduced to support PCIe ® 5 and XCede ® HD3 (in development) is targeting support of 112G PAM4 with future PCIe ® Gen 6 support in. 3A per pin current rating and mount individually to the backplane. REFER TO TB-2150 FOR XCede PRODUCT SPECIFICATIONS. Login or REGISTER Hello, {0}. ExaMAX ® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. Complementary guide and power modules are also included in the product range. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 1. 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. The XCede HD2 connector family consists of modular configurations with custom power and guidance. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. backplane to expander board connector (BP_XCEDE_2) 3. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. These connectors are ideal for meeting a wide variety of application needs, including Ethernet and PCI. 00mm pitch (FF5026) and 050mm pitch (FF3025). 5 - Effective capacity assumes average 4:1 data reduction. 4. 特色. c-jx410-51594 a creo files jx410-51594_bp . Features. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. Login or REGISTER Hello, {0}. Contact Mouser (USA) (800) 346-6873 | Feedback. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. The XCede HD2 connector family consists of modular configurations with custom power and guidance modules. Connector, XCede HD Series, 100 Contacts, 1. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. Complementary guide and power modules are also included in the product range. 6. Integrated guidance, keying and polarizing side walls available. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. EN. Up to 82 differential pairs per linear inch. Search. DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co-planar applications. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks.